FlipChip Pt 1000 0603 3FC class F0.15, taped

Platinum Sensors

Our platinum temperature sensors provide solutions for extreme temperature applications and are designed with the highest quality materials, allowing them to operate within a wide temperature range of -200 °C to +1000 °C.  Standard IEC 60751 sensors are offered in class F0.3 (0.12 %), class F0.15 (0.06 %), F0.1 (0.04 %), and higher accuracies upon request. Our sensors are available in wireless (SMD) and wired configurations, and in sizes ranging from  0.75 mm to 10 mm (L), and 0.75 mm to 5.08 mm (W).  Standard sensors can be customized with a variety of lead wire materials, insulation, length, and configurations.

With many years of experience, we also offer development of customer-specific applications in terms of sensor technology development and consultation. As part of the standard development process, we give support at the point of implementation — this way we ensure the best sensor solution for specific applications.

SMD and FlipChip

We offer wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g., SAC305-tinned wrap-around contacts for the normal PCB assembly process, high-temperature solder wrap-around contacts for high-temperature applications up to +250 °C, or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206), with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time, and low self-heating.

The wireless FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time, and low self-heating. The FlipChips are developed with contacts on one side, resulting in no short-circuit risk on the backside of the chip. Furthermore, we offer different FC technologies for different assembly processes (reflow-soldering, bonding, or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (iST reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request.

FlipChip

The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​

ESD optimized design

To strengthen the stability of your assembled systems, we are committed to the continued optimization and development of ESD-optimized temperature sensors.

With optimized design and new process technology, we offer platinum temperature sensors with outstanding ESD resistance. The designs have been tested according to European Union Standards, the IEC/EN61000-4-2.

Thanks to a state-of-the-art in-house ESD laboratory, we are able to test our sensors internally according to international standards.