BondSens Pt1000 class F0.3
Bondable platinum 1000 Ohm RTD component, temperature range -50° C to 150° C, chip tray (sensor side up)
Our smallest temperature sensor with 0.1 x 0.2 mm (L x W) bondable contacts
Product Name | P1K0.0707.3FC.B.T.S |
Nominal resistance | 1000 Ω at 0 °C |
Operating temperature range | -50 °C to +150 °C |
TCR | Pt 3850 ppm/K |
Chip size/dimensions | 0.75 x 0.75 x 0.3 mm |
Tolerance/class | IEC 60751 F0.3 (IST AG tolerance class B) |
Connection type | Bondable pads (Au) |
Description
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BondSens (0.75 x 0.75 mm)
Our smallest platinum temperature sensor operates within a temperature range of -50 °C to 150 °C (according to DIN EN 60751)and is designed for automatic placement in high-volume applications on printed circuit boards where long-term stability and interchangeability, combined with low cost, are important. This RTD is typically used in energy management for thermal compensation and in industrial and medical devices.
It features a very small size of 0.75mm x 0.75mm, very low drift, and can be integrated into semiconductor devices. It is also designed for Au-wire bonding.
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Platinum Sensors
Our platinum temperature sensors provide solutions for extreme temperature applications and are designed with the highest quality materials, allowing them to operate within a wide temperature range of -200 °C to +1000 °C. Standard IEC 60751 sensors are offered in class F0.3 (0.12 %), class F0.15 (0.06 %), F0.1 (0.04 %), and higher accuracies upon request. Our sensors are available in wireless (SMD) and wired configurations, and in sizes ranging from 0.75 mm to 10 mm (L) and 0.75 mm to 5.08 mm (W). Standard sensors can be customized with a variety of lead wire materials, insulations, lengths, and configurations.
With many years of experience, we also offer development of customer-specific applications in terms of sensor technology development and consultation. As part of the standard development process, we give support at the point of implementation — this way we ensure the best sensor solution for specific applications.
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Small dimensions
We offer various sensor solutions for applications with limited space requirements.
MiniSens
Our MiniSens features the smallest footprint, with dimensions of only 1.2 mm x 1.6 mm, making the sensor an optimal solution for limited space applications. The MiniSens is available with accuracies of up to IEC 60751 F0.1 (IST AG reference class Y) and with long directly welded wires. The sensor can be used in applications with an operating temperature range of up to +600 °C.
The MiniSens is also offered with a metallized backside enabling optimal thermal coupling.
SlimSens
Our SlimSens sensor is specially developed for applications requiring sensors fitted into tubes with very small diameters. The SlimSens measures 0.8 mm x3 mm and is the optimal solution for applications with tube diameters from 1 mm. The SlimSens is available with accuracies of up to IEC 60751 F0.1 (IST AG reference class Y) and with long directly welded wires within various ohmic resistances. This Pt temperature sensor can be used in applications with an operating temperature range of up to +600 °C.
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SMD and FlipChip
SMD
We offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.
The wireless FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, we offer different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (iST reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request.
FlipChip
The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.